Structure of the Buried Metal-Molecule Interface in Organic Thin Film Devices

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By use of specular X-ray reflectivity (XR) the structure of a metal-covered organic thin film device is measured with angstrom resolution. The model system is a Langmuir-Blodgett (LB) film, sandwiched between a silicon substrate and a top electrode consisting of 25 Å titanium and 100 Å aluminum. By comparison of XR data for the five-layer Pb2+ arachidate LB film before and after vapor deposition of the Ti/Al top electrode, a detailed account of the structural damage to the organic film at the buried metal-molecule interface is obtained. We find that the organized structure of the two topmost LB layers (5 nm) is completely destroyed due to the metal deposition.
Original languageEnglish
JournalNano Letters
Volume9
Issue number3
Pages (from-to)1052-1057
ISSN1530-6984
DOIs
Publication statusPublished - 2009

ID: 10735650